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ATTEND THE RIGID PACKAGING FORUM 2024!
The all-new Rigid Packaging Forum is here. Synergistically combining AMI’s thin wall packaging and plastic closure innovation experience in a new format, the Rigid packaging Forum is the new main event for the North American rigid packaging industry. The forum will feature two theaters, one will cover rigid packaging innovations and the other will center around plastic closure innovations. The topics covered in the main theaters will explore the best ways to promote innovation, functionality, operational excellence, and sustainability across various rigid packaging formats. The event will take place on June 25-26, 2024, in Cincinnati, OH, USA. Click the link Below to learn more.
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